PTFE Coppr clad laminate
PTFE copper clad laminate sheet is glass fabric based epoxy resin and PTFE copper clad laminate with excellent performance in heat resistance and thermal mechanical strength. It is suitable for printed circuit boards that required high density and excellent heat resistance,it is also widely used for Mobile communication production, GSM, CDMA, 3G and so on.
Thickness: 0.1-5.0 mm
Copper: 1 μm;2 μm;3 μm;4 μm;6 μm,
DielectricConstant:2.55,,2.65,2.75,2.85,2.95, 3.00, 3.3, 3.5
DF:0.0030 @ 10GHz
Operating temperature: -60
±260
℃
Heat Conduction Coefficient: 0.8 Kcal/m/hour °C
Water absorption: ≤0.02
%
Size: 1.2x0.55m,1.13x0.44m,1.030*0.44m,0.88x0.4mm, 0.88x0.51m, 0.88 x 0.55m, 0.66x0.44m, 0.6x0.5m, 0.51 x 0.51m,0.55 x 0.44m,0.4 x0. 44m,0.43 x 0.36m,0.3 x0.25m
Bulk resistance:1x10
12 M
Ω cm
Application:Mobile communication production, GSM, CDMA, 3G and so on.
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Category:
Copper Clad Laminated sheet