Ceramic-based Copper Clad sheet
Advantage:Better mechanical strength;High anti-stripping strength.Outstanding high-frequency Excellent Thermal Conductivity;Excellent stability for the cycle of high and low temperature;Coefficient of thermal expansion close to silicon chips.no need the transit layer as assembling and apply for the COB.Without Pollution.
Copper Foil:1 μm;2 μm;3 μm;4 μm;6 μm
Size: 100x100mm.
Peel Strength(Min): ≥1.8 N/mm.
Break-down Voltage(Min): >20 KV.
Heat Resistance: ≤1.1 ℃/W
Dielectric Constant (Max)1MHz:≤8.5
Surface resistance: >106 MΩ. C-96/35/90 >106MΩ.
Bulkresistance: >106MΩ.m C-96/35/90 >106MΩ.m
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Category:
Copper Clad Laminated sheet